Adhesive-less Laminates, Novaclad

Description: Adhesive-Less Laminates, Novaclad is the solution when a high performance material is required for high density, micro via and extreme environment applications. Flexible thin copper is deposited onto high temperature and chemically resistant polyamide films to create laminates that offer new levels of design flexibility. Vapor deposition technology means no adhesive is used, leading to a high performance lamination. Novaclad allows electronic designers to take full advantage of the dielectric properties without a layer of adhesive. Sheldahl's Novaclad materials offer significant benefits for mass-produced products, such as cell phones, digital cameras, automotive interconnects, sensors, switches, control units, flex jumpers and a variety of other applications. It is used in applications such as transmission control module, engine control unit, brake sensors, ink jet cartridge, RFID, antennas, ultrasound equipment, cell phones, displays, disc drives, digital cameras, chip-on-flex (COF), and IC packaging. Novaclad from Sheldahl is a family of adhesive-less laminates, created to meet the demanding needs of electronic packaging designs.