Profile: Advanced Interconnection Technology Ltd. specializes in the manufacture of interconnection products. We develop interconnection products based on the pattern plating of copper onto ceramic. Our products consists of features like high electrical conductivity, mean electrical insulation, high frequency characteristics, supportive thermal management parameters, thermal, chemical and mechanical stability. We develop our products using two different seed layers to give two distinct technologies with radically different properties and four different photo-resists for optimal use in different types of application. One of the enhancement we stitch into our products is the process of integrating leads onto a substrate. Through our processing technology we process leads by photographic imaging. By this task the form of the leads can be optimized for the related application. In particular, power leads can be placed on the same substrate as signal leads.