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American Dicing, Inc.

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Web: http://www.americandicing.com
E-Mail:
Address: 344 E. Brighton Ave., Syracuse, New York 13210, USA
Phone: +1-(315)-428-1200 | Fax: +1-(315)-428-1211 | Map/Directions >>
 
 

Profile: American Dicing, Inc. offers wafer dicing, die sorting and packaging services. We also provide precision wire bonding and die bonding services. Our fully automatic die sorters include wafer mapping and vision inspection before picking and place into a variety of outputs. Our saws are fully programmable to efficiently handle small and large quantities of wafers and substrates.

5 Products/Services (Click for related suppliers)  
• Die Bonding Equipment• Electronics Components• Semiconductor Wafer Cards
• Semiconductor Wafer Dicing• Semiconductors

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