Profile: Applied Thin-Film Products provides thin-film processing. We are an ISO 9001:2000 certified company. Our product line includes standard metalization, solderable nickel metalizations, palladium metalization, plate thru vias, polyimide bridges, and plated gold bumps. Our plated gold bumps on aluminum oxide are used to eliminate wire bonding which will improve electrical performance at higher frequencies. This is done by eliminating long bond wires & flipping the chip on to the gold contact bumps. We offer Fractal Fasten®, which is an unique backside metalization developed to enhance the adherence of substrates to carriers using both paste and sheet epoxies. We provide polyimide supported bridges, which are a dramatically improved alternative to traditional wire bonding and standard air bridges.