Profile: Aries Electronics, Inc. offers interconnection & packaging solutions for testing and burn-in applications. We manufacture a broad range of interconnect products and Correct-A-Chip™ technology. BGA switch-a-pitch adapter reduces HDI construction by adapting smaller pitch devices to larger footprints. It converts 0.4 mm and 0.5 mm pitch footprints to 1 mm or 1.27 mm pitch. It enables the use of standard line and trace spacing, & eliminates the need for laser-drilled micro vias motherboards. P/N 1109681-XXX mirror image collet socket re-routes connections from a row of female contacts on top, to the opposite row of male pins at the bottom. ICs can be replaced at the opposite side of a PCB.