Profile: Automation Technology, Inc. provides engineered solutions utilizing leading edge technology for the simplest to the most complex industrial applications. Our product line includes vacuum sealing & wafer demounting systems, BT-200 box taping machine, notch polish pads, and vacuum chucks. Our ATI VS system is a reliable, economic vacuum sealing method for a wide variety of products and packages. It conforms to semi-conductor industry class 10 clean room rating. The VS-100 can process single wafer shipping boxes up to 150mm wafer diameters. Depending on recipe parameters the VS-100 can process in excess of 60 vacuum-sealed wafer shipping boxes per hour. The VS-100 is adaptable for use in any industry that requires a high quality vacuum seal. The optional high purity nitrogen purge feature is available to meet semi-conductor requirements. Our SCC-200 is a fully automated system designed to provide cost-effective post wire saw wafer processing. The single SCC-200 station can singulate, clean, and cassette up to 400 wire-sawn wafers within 45 minutes. The manipulator loads a wire-sawn ingot into the process chamber for demounting. The automated wet process detaches the wafers to ensure there is no damage to the wafer edge. The " no edge contact" techniques are used during the wafer handling, cleaning, and cassetting operations. The rotating 16-cassette carousel enables unloading of full cassettes while other wafers are still being processed.