The capacitor structures consist of a first electrode, capacitor dielectric and top electrode. It is formed on a passivation layer overlying the interconnect metallizations. The capacitor electrodes are interconnected to the underlying integrated circuit from underneath; through conductive vias to the underlying interconnect metallizations. The method provides for adding capacitors to an otherwise completed and passivated integrated circuit. The structure is particularly applicable for ferroelectric capacitors. The passivation layer acts as a barrier layer for a ferroelectric dielectric.