Profile: Chapman Instruments, Inc. offers solution for surface profiling and thickness gauging. The MPT1000 is a non-contact system, providing wafer thickness measurements. It can be used as a production tool for in-line quality inspection, a research and development tool for establishing standards, and compiling data for enhancing productivity. This utilizes a non-contact measurement technology with a focused laser spot on the wafer surfaces. It can measure structured taped wafers after backgrind or dicing. The MP2200 is designed to be used as both a disk production tool for in-line quality inspection, as well as a research and development tool for establishing standards & researching tolerances. It utilizes the same non-contact measurement technology, but features a shorter wavelength light source (543 nm).