Profile: Coining, Inc. manufactures metallic, custom-shaped solder and braze preforms used in producing semiconductors. Our solder & brazing preforms are precision metal stampings used for a variety of joining applications in manufacturing electronic devices and systems. Some of these parts are as small as 0.0035 inch square (0.09 mm) and as thin as 0.0003 inch (0.0076 mm). Typical solder preform uses include attaching electronic circuitry, packaging electronic devices, providing good thermal and electrical conductivity & providing an interface for electronic connections. Square, rectangular and disc shaped solder preforms are commonly used to attach electronic components containing silicon dies to a substrate such as a printed circuit board. We provide small metal stampings that are used as jumper chips, bonding pads, covers, heat sinks, lead frames, tabs, terminals or other components on microelectronic assemblies and packages. These precision stampings are used promarily to dissipate heat or provide an interface for an electronic circuit or component.