Profile: First Level Inc. specializes in microelectronics packaging. We offer design, process, and manufacturing services. Our services include prototyping, production, process development, optoelectronics technology, package & substrate design, design validation, lead frame design and consulting. Our applications include silicon optical bench assemblies, lasers, photo detector mounting, optical alignment, hermetic & non-hermetic sealing and transponder assemblies. Our stud bump is a method for connecting semiconductor devices onto a wide range of circuit board materials. The stud bump is attached directly onto standard, wire bond pads and can be manufactured from any of the materials normally used for wire bonding.