Profile: FlipChip International, LLC is a WLCSP bumping supplier. We offer product engineering services, wafer level packaging solutions, standard flip chip services, full test plan design on open platform, software development, hardware development, hardware purchase, test solution debug and production volume probe, standard low tack and UV tapes. FCI offers a full suite of electroplated Cu based options including standard and NANOPillarTM Cu pillar bumps, electroplated Cu RDL for inductor on chip and high current applications, and electroplated Cu based WLCSP alternatives targeting leading edge Cu Low K device technologies.