Profile: GDSI provides grinding and dicing services. We are an ISO 9001:2000 certified company. We offer wafer grinding and polishing, wafer automated inspection and wafer dicing. Our wafer dicing is the process by which individual silicon chips and integrated circuits on a silicon wafer are separated following the processing of the wafer. Our brands include STM™.
5 Products/Services (Click for related suppliers)
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• | Electronics Components | • | Grinding & Machining Services | • | Industrial Machinery |
• | Precision Semiconductor Wafer Grinding | • | Semiconductors |