Profile: Heraeus Materials Ltd specializes in bonding wires and microbond assembly materials. Our product line includes gold, copper, & aluminum bonding wires, solder pastes & wires and fluxes. Our gold bonding wires are manufactured from high-purity starting materials (99,999%) with doping additions. The wires are corrosion resistant and display homogeneous chemical composition and stable mechanical properties. The wire surfaces are very clean and of high quality. Gold bonding wires are principally used in the production of plastic packaged components. The highest processing rates are achieved by using the ball/wedge bonding process. We offer a wide selection of gold ball bonding wires in a full range of diameters to suit the applications, from high-power & discrete components to high pin-count and ultra-fine pitch devices. We also offer a full line of no clean, solvent clean, and water soluble solder pastes for surface mount and semiconductor applications. These pastes are compatible with a variety of reflow methods including convection, vapor phase, and vacuum systems. Solder pastes are available in particle sizes ranging from Type 3 to Type 8 powders for standard and ultrafine printing requirements. Dispensable versions are also available for air over and positive displacement systems. These Pb Free pastes provide industry leading wetting and outstanding void performance on a variety of component terminations and surfaces.