Profile: Hybrid Laser Technology Ltd. specializes in manufacturing and supplying precision laser cut ceramic substrates to the micro-electronics industry. Our services include laser cutting & profiling, scribing, drilling, and engraving of ceramic substrates. Our laser machining is the process of cutting and profiling a range of materials by vaporizing the portion encountered in the very small, well defined laser path. Unlike conventional machining methods, precision laser cutting is used to achieve complex cut patterns. Laser cutting is often used on materials such as ceramics, metals, and plastics. It is also being used in more delicate applications using materials such as wood, paper, and acrylics. Our laser hole drilling of materials such as ceramics, alumina & ALN, offer high-accuracy and repeatability favored by the medical device industry, semiconductor manufacturing, and nanotechnology support systems.