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Integrated Packaging Assembly, Inc.

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Contact: Martin Paul - Sales
Web: http://www.ipac.com
E-Mail:
Address: 3399 W. Warren Ave., Fremont, California 94538, USA
Phone: +1-(510)-770-0322 | Fax: +1-(510)-770-0323 | Map/Directions >>
 
 

Profile: Integrated Packaging Assembly, Inc. provides IC packaging, system & module assembly, wafer bumping and related services. We design, develop and contract manufacturing of embedded micro controller and other systems. We offer embedded software designing, PCB layout & mechanical design and gold wire bonding.

3 Products/Services (Click for related suppliers)  
• Electronics Components• Printed Circuit Boards• Semiconductors

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