Profile: Interplex Technologies Corp. is a provider of printed circuit board and surface mount assembly services. Our solder bearing and flux bearing lead technology are used in applications such as memory modules, multichip modules, ceramic printed circuit boards, power modules, connector assemblies and sensor assemblies. Our CAP-LOC™ system is a solderless mounting system for electrolytic capacitors that eliminates the secondary processes of soldering, adhesives and clamps commonly used to make the electrical and mechanical connections to printed circuit boards. We serve the industries such as medical, automotive, military and aerospace industries. We provide a wide range of services such as through hole & mixed technology assemblies, press-fit back panel assemblies, electro mechanical assembly, custom lead attach, full turn-key manufacturing & full program management, insert molding & metal stamping services.