Profile: Lam Research Corp. is a supplier of wafer fabrication equipment and services to the worldwide semiconductor industry. Our product line includes conductor & dielectric etch, software and legacy products. Our 2300 Kiyo product family combines evolutionary advances and revolutionary technology to provide exceptional critical dimension (CD) uniformity and productivity for a wide range of front-end-of-line (FEOL) and middle-of-line (MOL) conductor etch applications. metal etch systems are used for the majority of aluminum metal etch processes that create the wiring in memory devices. The 2300 Versys Metal45 etch system leverages Lam proprietary TCP technology to provide a flexible platform for back-end-of-line (BEOL) metal etch processes. There applications include etching high-density aluminum lines, aluminum pads, and the critical dimensions of TiN metal hardmasks that are then used to define the tightest copper metal lines in logic circuits. The system utilizes proprietary chamber cleaning technology to provide availability, yield, and exceptional process repeatability. Our TCP® 9400DSiE™ deep silicon etch system is based on Lam's production-proven TCP 9400 silicon etch series with more than 1,600 chambers installed worldwide. The system's patented high-density TCP plasma source provides an ideal configuration to meet the challenges of silicon deep reactive ion etch. It also offers a broad process capability and flexibility fora wide range of MEMS, advanced packaging, and power device applications.