Profile: Marpet Enterprises, Inc. produces manual and automated assembly equipment. We offer wire bonders and die attach equipment. Our MEI1204W is designed for ultrasonic, thermosonic, or thermocompression wedge bonding of IC's, hybrids and microwave devices. Our MEI907 wedge bonder is used for ultrasonic, thermocompression and thermosonic bonding. Our accessories include wire bonders, die attachers and pull testers.
5 Products/Services (Click for related suppliers)
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• | Ball Bonders | • | Industrial Machinery | • | Machine Shops |
• | Packing Equipment | • | Wedge Bonders |