Profile: Micro Assembly Technology provides multichip module and assembly technologies for the electronics industry. We specialize in prototype & low-volume flip chip assembly services for fine-pitch (100µm) pixel imaging devices and temperature sensitive II-VI & III-V group materials, including radiation detectors, bio-medical sensors & optical/polymer-MEMS. The technology utilizes low-cost, low-temperature curing silver-filled (non-leaded) conductive epoxies that are applied using a patented stencil printing technique. Interconnection densities in excess of 16,000 I/O per chip have been achieved with this technique using low applied forces. The electrically conductive and non-conductive polymer inks used in this process are cured at temperatures as low as 70°C and are therefore important for temperature sensitive component assembly.