Description: M22XDL-650 benchtop automatic optical inspection system is presenting today's manufacturers with a breakthrough solution for handling large board sizes of up to 650 x 550 mm. Ideal for large PCBs such as back panels, the M22XDL-650 supports comprehensive board inspection, including SMT components, reflow and wave solder joints, and solder paste. In addition, since larger boards typically feature multiple THT connectors, the new machine incorporates unique technologies specifically designed to optimise THT solder joint inspection. With an inspection capability of 100,000 components per hour, the M22XDL-650 is powered by an Intel Pro Mac control system, which equips it to deliver best-in-class true 24-bit colour imaging. In addition, 22XDL generation introduces an innovative lighting concept incorporating 3 pulse wave modulated LED light sources and up to 6 different lighting combinations. When combined with ease of programming and a substantial usability advantage, the system significantly enhances operator control for highly reliable board inspection. Featuring a bottom side clearance of 100 mm and a top side clearance of 40 mm, the M22XDL-650's versatility effectively meets the challenges of odd form components.
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