Profile: Optocap Ltd. is a design, engineering and manufacturing service provider for packaging & assembly in the microelectronics and optoelectronics industry. We provide advanced packaging solutions to a world-wide client base of blue chip multinationals and leading edge start-ups. We focus on the full product development cycle from design, prototyping, qualification, failure analysis and manufacturing. Our services & capabilities include package design, modeling & verification, prototype & pilot assembly, new product introduction, automated volume manufacturing process development, process transfer, volume sub-contract manufacturing, supply chain management, environmental testing, device testing & characterization, failure analysis, and corrective action support. We develop advanced device packaging solutions for the communications, consumer, industrial, medical and automotive markets. Working on optoelectronic, microelectronic, MEMS & biotech devices, micro displays and sensors, our expertise in packaging solutions spans the development process from design consultancy through prototyping, qualification, failure analysis, volume manufacturing, reliability testing, & transfer to low-cost volume manufacture. Our turn-key, precision assembly solutions support customers in reducing the time to market for new product developments, reducing technical risk by following tried & tested platforms and reducing costs by shortening assembly build times, & improving yields.