Profile: Promex Industries, Inc. specializes in packaging foundry and IC assembly service. Our microbonds insulated X-Wire™ technology allows bonding wires to make contact with each other without electrical shorting, permitting fuller utilization of the x, y and z dimensions in microelectronic package design. X-Wire™ is fabricated with a continuous insulating coating. It provides control of bonding wire impedance with ground wires parallel to signal wires. We provide process development, materials centric packaging and assembly services to LED array market. Ceramic substrates and custom configurations of R, G, or B LED's are die attached, wire bonded, encapsulated and continuity tested to the required specifications. System-in-package (SiP) modules include 2D, 3D, SMT and flip chip configurations on various substrates and lead frame based packages.