Profile: Quik-Pak specializes in advanced IC Assembly and Prototyping services. We are an ISO 9001:2000 certified company. We offer wafer preparation, IC packages & assembly, advanced assembly and laser micro machining. Our open cavity plastic packages (OCPP) are the ideal platform for new IC prototypes. They are mechanically and electrically identical to future transfer molded production parts. We provide complete prototype assembly services, from wafer preparation to die bonding & wire bonding, encapsulation, flattening/remolding, and marking/branding. We offer wafer backgrinding or thinning, dicing of silicon, glass, quartz, laminate, ceramic and panels, die sort, or pick & place, and wafer washing.