Profile: Remtec, Inc. specializes in plated copper on thick film PCTF® ceramic substrates. We are ISO 9001:2000 certified. Our PCTF® ceramic metallization technology helps us to provide design and fabrication of moralized ceramic boards, chip carriers, packages & specialty components for various electronic applications. We also provide assembly of surface mount components (especially power SMC), chip-on-board (COB) applications, chip scale packages (chip carriers, flip chips, BGA), SMT multichip modules (MCM), packages for direct pc board mount as well as hermetic power packages integrating multiplayer substrate with plated copper and hermetic vias into a package base. Our products are commonly used in telecommunications, sensors, wireless and fiber optic data transfer devices, biomedical instrumentation, power supplies & optoelectronics. Our applications also include high density DC/DC converters and power modules, RF & microwave modules, RF power amplifiers, RF power supplies, TR modules, filters, optical switches, chip carriers for Si and GaAs IC's & other electronic assemblies.