Profile: Resdel Corp. distributes conductive tubing & encapsulation cups. Our encapsulation materials include epoxies, urethanes and silicones. The encapsulation cups are used for electronic component packaging. We market epoxy formulations like thermal/shock resistant, machining & fabrication capabilities and header/tubing assemblies. Our formulations are used for EMI protection, stiffness and high dielectric strength. Our fabrication capabilities include turning, milling and drilling.