Profile: Ron Kehl Engineering, provides plating/polishing services. We focus on super-abrasive technology, R&D and consulting. We serve semi conductor, data storage and ultrasound industries. Our cylindrical grinding is used for special angles and wafer reclaiming. Our double side lapping and polishing is used mainly for diamond applications. Our equipment is capable of grinding, lapping and polishing a wide variety of material, using various lapping compounds, slurries & diamond finishes.