Profile: Royce Instruments, Inc. designs & manufactures precision assembly tools and bond testing equipment. Our bond testing systems can handle a variety of testing applications including wire bond pull testing, wire bond ball shear testing, BGA ball shear & cold ball pull testing, die shear testing, and high speed ball shear testing. Our system 650 universal bond tester features motorized height controlled microscope that stays in focus as it moves, and die shear up to 200 Kg. Our die sorters range from semi-auto table top systems to automatic high speed 300 mm systems with wafer map and ink-dot die selection. Wafer map capabilities include multi-project wafers (pizza maps), and a range of industry standard wafer formats.