Profile: SST International develops microelectronic package assembly equipment and technology. We serve industries such as telecommunication, semiconductor, electronics, automotive, defense and aerospace. We offer turnkey system for eutectic die bonding, flux-less solder reflow, MEMS package sealing and component assembly. Our product includes vacuum/pressure furnaces and wafer bonders. Our model 3140 & 3150 high vacuum furnace is a high vacuum thermal processing furnaces used for MEMS package sealing, getter activation & very high reliability and low moisture hermetic package sealing.
14 Products/Services (Click for related suppliers)
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• | Electrical Equipment | • | Furnace Fixtures | • | Graphite Machining Services |
• | High Vacuum Furnaces | • | High Volume Production Furnace | • | Hot Pressing Dies |
• | Packaging Machine | • | Packaging Machinery | • | Precise Locating Inserts |
• | Pressure Furnaces | • | Resistive Heating Elements | • | Table Top Solder Reflow Station |
• | Vacuum Systems | • | Wafer Bonders |