Profile: Semiconductor Equipment Corp. designs & manufactures a wide range of manual & semiautomatic assembly, rework, handling and test equipment used in the development & production of microelectronic devices for the photonics, semiconductor, hybrid & printed circuit industries. Wafer/film tape applicator provides users with the optimal control of temperature and pressure for achieving uniform bubble-free mounting of electronic grade processing tape onto wafers and their film frames for subsequent cutting of wafers into die. The model 300 is specifically designed for 300mm wafers. We provide a variety of tapes which are manufactured specifically for semiconductor wafer dicing and for ceramic hybrid substrate sawing. These tapes are also useful for surface protection and many other applications that require an adhesive tape with relatively low adhesion, no adhesive transfer & the ability to stretch without tearing.