A spray plating method is used wherein a multiplicity of spray nozzles mounted on a feed pipe, direct a high velocity spray at an article to be plated. The spray is deflected onto portions of the article by metal deflectors located near the article. The deflectors serve as the anode of the plating process. This results in a high current density and a high plating rate. The method is used for hard plating gold onto connector pins or other articles on a continuous strip-plating line.