Description: PumpPrint stencils cover a wide range of applications ranging from the now industrial standard of SMT adhesive application to silver epoxy die attach, high volume depositions of solder paste and extrusive reflow. PumpPrint stencils allow surface mass image printing of any multiple combination of deposit heights even on pre-populated surfaces in one single print stoke cycle. Pump Printing opens up a wide range of manufacturing process alternatives with potential for reducing manufacturing cost along with process cycle time reductions. PumpPrint is the fastest, most flexible and cost-effective way to deposit adhesives. It is much faster than conventional dispensing, with the ability to deposit thousands of mulls-height glue dots in one go with fast production line rates. Applications involving other electronic materials such as solder pastes, underfills and encapsulants also benefit from PumpPrint technology. PumpPrint stencils are made from a plastic material that is easily and accurately machined. They are available in a standard thickness of 3.0 mm to suit any assembly, enabling deposit heights from 75µm to >2 mm.
