Profile: Tru-Si Technologies, Inc. provides atmospheric downstream plasma processing equipment to the semiconductor industries. We offer services for damage-free wafer thinning, thin-wafer damage and stress removal, ultra-thin wafer handling & flexible integration of thin-wafer processing tools. Our services include such as grinding, gas etching, frame mounting and dicing. We also offer atmospheric downstream plasma gas etch systems which provide post-grind thinning and back side damage removal for silicon wafers & its damage free thinning capability improves wafer & die strength.