Profile: Winslow Automation, Inc. provides robotic lead tinning machine capable of processing a variety of components. Our products include ball array preform, BGA reballing kit, column grid array preform, chip carrier mounting device and fine p0itch component flux & lead tinning system. Our robotic lead tinning machine designed to solder dip all types of semiconductor packages including fine pitch and high density packages.
4 Products/Services (Click for related suppliers)
| |||||
• | Gas Cutting/Welding Apparatus | • | Lead Forming Equipment | • | Soldering Machinery |
• | Welding Equipment & Systems |