Bend testing measures the ductility of materials. Terms associated with bend testing apply to specific forms or types of materials. Bend testing provides a convenient method for characterizing the strength of the miniature components and specimens that are typical of those found in microelectronics applications. It is particularly useful to determine the local bending fracture strain of welded butt joints because of heat affected zones. The bend test is also very suitable for determination of the fracture ductility of thicker plates in the z-direction.