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Properties
Master Bond systems are custom formulated to achieve outstanding performance properties custom formulated to maximize production, ensuring that your end result meets your expectations. Some properties include:
Chemical resistance
Electrical conductivity
High/low temperature resistance
High shear/peel strength
Thermal conductivity
Flame resistance
Innovative Polymer Systems by Master Bond
LED401 - Breakthrough system based on LED curing technology. This adhesive, sealant, coating and encapsulant cures tack-free upon exposure to a 405 nm wavelength light source, without any oxygen inhibition. Optically clear and suitable for applications involving heat sensitive substrates.
FLM36 – Film adhesive compound demonstrating flexibility, high temperature resistance up to 500°F and thermal conductivity. It provides uniform bond line thickness and limited squeeze out during bonding.
Super Gel 9 - Featuring extraordinary softness and retention of dimensional stability. It is a superb electrical insulator and is an easy processable two component system with a convenient two to one mix ratio, optical clarity, and low viscosity.
EP21TCHT-1 – A thermally conductive, heat resistant epoxy compound formulated to cure at ambient temperatures or more rapidly at elevated temperatures. It passes NASA low outgassing tests and develops a high bonding strength.
MB600S - An aqueous based sodium silicate coating formulated for applications where electromagnetic interference/radio frequency interference (EMI/RFI) shielding is required.
Resources
Master Bond offers an extensive resource library compiled by our technical specialists for design engineers. These resources feature information on our latest compounds as well as how-to demonstrations and discussions regarding general developments in the adhesives industry. Our library offers: