Profile: Pac Tech. is a provider of wafer bumping, packaging and solder ball placement equipments. We are an ISO 9001 certified company. Our laser marking systems are used for laser marking of silicon wafers in wafer level packaging and it allows marking of product logos, cell codes and fond sets for product identification and traceability. Our Pacline 300 A50 is a automated equipment which contains a complete software solution for recipe management, process control and data logging & its emergency routines are providing a secure system operation for handling of up to 3 process carrier in parallel. Our spin coater is equipped with two hotplates for wafer curing and baking at different temperatures & it is available as semi-automatic system with manual loading or fully automated system with cassette to cassette handling. We offer a complete set of wafer level and back-end services including sawing, dicing, redistribution, backside laser marking, backside coating and test die & assembly.