Laser marking is a non-contact process, and thus it minimizes mechanical distortion and introduces no contamination. It is especially applicable to marking of small, delicate, high-value assemblies, like semiconductor wafers. Thus, even though laser equipment is often more expensive than competing technologies, laser-marking applications in industry have become common and are increasing in number. It offers a flexible, sophisticated alternative to conventional marking of products. It is increasingly used in the production process to incorporate features, which either simplifies of permit flexible computer-aided manufacturing.