Laser line scanner works exceptionally well from a towed or moving platform for underwater search and/or surveys. The laser line scanner, in its simplest form, is a sensor that takes advantage of a laser to concentrate intense light over a small area in order to illuminate distant targets and extend underwater imagery beyond that offered by more conventional means. It builds up an optical image from a rapidly acquired series of spots on the seafloor, each sequentially illuminated by a pencil sized diameter laser beam that scans the bottom perpendicular to the direction of the sensor support platform. This technique minimizes the effects of forward scattered and back-scattered light.

Laser Machining services use computer-controlled lasers to perform a variety of material removal processes. These lasers are positioned and controlled with a high degree of accuracy. Laser machining services differ in terms of material capabilities, machining capabilities and applications. Laser machining specializes in cutting, drilling, etching, marking, milling and skiving operations for semiconductor wafer manufacturing. This machining service performs micromachining for medical devices or multi-axis material rotation.

Laser marking is a non-contact process, and thus it minimizes mechanical distortion and introduces no contamination. It is especially applicable to marking of small, delicate, high-value assemblies, like semiconductor wafers. Thus, even though laser equipment is often more expensive than competing technologies, laser-marking applications in industry have become common and are increasing in number. It offers a flexible, sophisticated alternative to conventional marking of products. It is increasingly used in the production process to incorporate features, which either simplifies of permit flexible computer-aided manufacturing.